| Specifications | Standard capabilities |
|---|---|
| Materials | FR4-Tg130° ; FR4-Tg150° ; FR4-Tg170° ; IMS ; ... |
| Types | Single sided, Double sided, Multilayers upto 40 layers, IMS,... |
| Final board thickness | From 0.50mm to 3.20mm |
| Min. core thickness | 0.10mm |
| Copper thickness | From 9µm to 210µm |
| Min. line width and spacing | 0.075mm |
| Min. mechanical drill | 0.15mm |
| Specific drilling | Laser drilling ; blind, buried and stacked vias |
| Vias | Optional via filling according to different IPC-6741 requirements |
| Solder mask | Standard green, other colours also available |
| Finishes | OSP ; HASL, leadfree HASL, ENIG, ENEPIG, Immersion Sn,... |
| Legend printing | Standard white, other colours also available |
| Other prints | Peel-off mask, carbon printing,... |
| Impedance control | Tol. +-10% |
| Quality control | AOI, 100% electrical test, IPC-A-600 class 2(class 3 on demand) |
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